Not long ago, Xiaomi reportedly working on two new generation smartphone that is expected to be supported by Qualcomm Snapdragon 670, Both the intended smartphone will reportedly have the name with the code “Sirius” and “Comet”. One of the two devices is likely to be called Xiaomi Mi Max 3. A new leaked image circulating on the internet shows a TPU-made casing designed for Xiaomi Mi Max 3. From the description of this casing can be known what kind of features and design language will be adopted on the device.
Based on the leaked images revealed that Xiaomi Mi Max 3 will feature a circular fingerprint sensor on the back. This smartphone will also be equipped with dual-camera features are placed vertically in the same section.
Rumor has previously stated that Xiaomi Mi Max 3 will maintain the existence of headphone jack and IR Blaster. This is apparently also reinforced with the leaked image. As for the USB port, microphone, and ranks of speaker holes will be placed below. Moderate power / on and volume control on one side.
Unfortunately, not much information related to the specifications and features that will be carried by Xiaomi Mi Max 3. Despite speculation that is fast circulating mention that this smartphone will diotaki by chip Qualcomm Snapdragon 670. Like the previous generation of mobile phone manufacturer, Mi Max 3 possibly also will adopt an aspect ratio of 18: 9 with a 6.9 inch landscape display. This very spacious screen will likely also be accompanied by a thin bezel design.
If we are based on the pattern of Xiaomi smartphone launch schedule, then the possibility of Xiaomi Mi Max 3 will be introduced to the public in early May 2018.
Source: AndroidHits via GizChina
